[Gllug] component level repair (was Open Source Hardware User Group meeting)

[Frank Scott]

On Wed, May 12, 2010 at 12:33:22AM +0100, Andrew Back wrote:
> > 
> > At fosdem the RepRap guru (Adrian Bowyer) recommended using a non-stick
> > frying pan calibrated with a cheap handheld infrared thermometer to do
> > SMT work.
> 
> I have little experience of SMT so what I think counts for little. However,
> this sounds more like a party trick - surely it's easier to control the
> temperature across surfaces to be soldered in an oven than it is with a
> stack of bits on a teflon pan? And doesn't industrial process use an oven
> rather than hotplate?
> 

Not a party trick. At Bath, they use a small hotplate in the lab. The
key use of the thermometer is to check for temperature uniformity across
the surface of the plate. You don't use a stack of bits but a single
layer and rely on the thermal mass of the hotplate to keep an even
temperature distribution ( A nice half inch slab of aluminium would be
even better). I wouldn't expect a very even distribution from a domestic
oven.
 
-- 
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    /V\    : ;`  :   Frank Scott  Sutton, London
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